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Why Are Aluminum Nitride Ceramic Substrates More Expensive Than Other Substrates?

wallpapers Industry 2020-11-17
As the best choice, the aluminum nitride ceramic substrate using LAM technology (laser rapid activation metallization technology) can make the bond between the metal layer and the ceramic tighter, and the bond strength between the layers is also higher. The height of metals and ceramics is very high, and the maximum can reach 45.Pa (the resistance of a thick ceramic plate exceeding 1mm). The aluminum nitride substrate has a stronger, lower resistance metal film layer, and the thickness of the conductive layer can be customized within 1μm~1mm.
Compared with traditional ceramic substrates, the thermal conductivity of aluminum substrates is 12W/mk. Although the thermal conductivity of copper itself reaches 383.8W/mK, the thermal conductivity of the insulating layer is only 1.0W/m.K, which is better. The 1.8W/m.K aluminum nitride ceramic substrate has excellent thermal conductivity, and the data range is 170 to 230W/m.k.
Take the coefficient of thermal expansion (CTE) as an example. In the field of LED lighting, the average thermal conductivity of the CTE of the main substrate is 1417ppm/C, while the average thermal conductivity of the CTE of the silicon chip is 6ppm/C. When the temperature rises, the PCB will expand more violently than the chip package. Causes desoldering problems. Under this problem, the CTE of the aluminum nitride ceramic substrate is 4-5ppm/C, which is closer to the expansion rate of the chip, which can effectively avoid similar situations.

In addition, the aluminum nitride ceramic substrate does not contain organic components, and the copper layer does not contain an oxide layer, and has a long service life. It can be used for a long time in a reducing atmosphere and is suitable for aerospace equipment.
Aluminum nitride ceramic substrates are widely used in the market. Due to their low high frequency loss and low dielectric constant, they can be used for high frequency circuit design and installation as well as high density installation. The line/spacing (L/S) resolution can reach 20m. Under the current light, thin and compact technology trend, it is very suitable for manufacturing short, small, light and thin equipment.
In the electronics industry, only the most appropriate is right. This has led to the emergence of products such as aluminum nitride ceramic substrates. These products with outstanding advantages will inevitably become a new trend confirming the choice of the times. As a better choice, aluminum nitride is the general trend.

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